Inspecting apparatus, three-dimensional profile measuring apparatus, and manufacturing method of structure

ABSTRACT

An aspect of an inspecting apparatus includes a profile measuring part measuring a profile of an object surface and an image detecting part detecting a light intensity distribution of the object surface by illuminating the object surface from mutually different plurality of directions.

CROSS-REFERENCE TO THE RELATED APPLICATIONS

This application is a continuation application of InternationalApplication PCT/JP2010/006774, filed Nov. 18, 2010, designating theU.S., and claims the benefit of priority from Japanese PatentApplication No. 2009-271328 and Japanese Patent Application No.2010-241263, filed on Nov. 30, 2009 and Oct. 27, 2010, respectively, theentire contents of which are incorporated herein by reference.

BACKGROUND

1. Field

The present application relates to an inspecting apparatus conductingdefect inspection of an object to be measured, a three-dimensionalprofile measuring apparatus, and a manufacturing method of a structure.

2. Description of the Related Art

There has been conventionally known an apparatus as described inJapanese Unexamined Patent Application Publication No. 2009-150773, asan apparatus of conducting three-dimensional profile measurement of ameasuring object.

However, in a three-dimensional profile measuring apparatus, it wassometimes difficult to detect small flaws and holes, due to arestriction in resolution and the like.

The present application has a proposition to provide an inspectingapparatus capable of detecting flaws and holes which were difficult tobe found only by a three-dimensional profile measuring apparatus, athree-dimensional profile measuring apparatus, and a manufacturingmethod of a structure.

SUMMARY

An aspect of an inspecting apparatus exemplifying the present embodimentincludes a profile measuring part measuring a profile of an objectsurface, an image detecting part detecting a light intensitydistribution of the object surface by illuminating the object surfacefrom mutually different plurality of directions, and a controlling partconducting non-defective/defective judgment of the object surface bycontrolling the profile measuring part and the image detecting part.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating a mechanical configuration ofa defect inspecting apparatus of a first embodiment.

FIG. 2 is an entire configuration diagram of the defect inspectingapparatus of the first embodiment.

FIGS. 3A, 3B, and 3C are diagrams in which auxiliary light sources 27-1to 27-8 and an image-forming optical system 25 are seen from a side of astage 12.

FIGS. 4A and 4B are diagrams explaining a relation among optical axes ofthe auxiliary light sources 27-1 to 27-8 and an optical axis of theimage-forming optical system 25.

FIG. 5 is a flow chart of defect inspecting processing performed by aCPU 15 of the first embodiment.

FIG. 6 is a flow chart of light intensity distribution measuringprocessing.

FIG. 7 is a flow chart of profile measuring processing.

FIGS. 8A, 8B, 8C, and 8D are diagrams explaining step S3.

FIG. 9 is a diagram explaining step S8.

FIG. 10 is a perspective view illustrating a mechanical configuration ofa defect inspecting apparatus of a second embodiment.

FIG. 11 is an entire configuration diagram of the defect inspectingapparatus of the second embodiment.

FIG. 12 is a flow chart (first half) of defect inspecting processingperformed by a CPU 15 of the second embodiment.

FIG. 13 is a flow chart (latter half) of the defect inspectingprocessing performed by the CPU 15 of the second embodiment.

FIG. 14 is a diagram explaining step S3 in the second embodiment.

FIGS. 15A, 15B, and 15C are diagrams explaining steps S101 and S102.

FIG. 16 is a block configuration diagram of a structure manufacturingsystem 200.

FIG. 17 is a flow chart illustrating a flow of processing performed bythe structure manufacturing system 200.

DETAILED DESCRIPTION OF THE EMBODIMENTS First Embodiment

Hereinafter, as an apparatus of a first embodiment, an apparatus being adefect inspecting apparatus, which is also a three-dimensional profilemeasuring apparatus, will be described. The apparatus of the presentembodiment is the defect inspecting apparatus when it is used for defectinspection, and is the three-dimensional profile measuring apparatuswhen the defect inspection is not conducted. Hereinafter, descriptionwill be made by setting that the apparatus of the present embodiment isthe defect inspecting apparatus, for the sake of simplification, but,the three-dimensional profile measuring apparatus also has the sameapparatus configuration.

FIG. 1 is a perspective view illustrating a mechanical configuration ofthe defect inspecting apparatus of the present embodiment. Asillustrated in FIG. 1, the defect inspecting apparatus includes a stage12 on which an object 11 made of an industrial product or part, forexample, is placed, and a projecting part 13 and an imaging part 14which are mutually fixed. There is provided an angle between an opticalaxis of the projecting part 13 (an optical axis of a projecting opticalsystem 24) and an optical axis of the imaging part 14 (an optical axisof a later-described image-forming optical system 25), and the opticalaxes of the both intersect on a reference plane of the stage 12. Out ofthe above, the optical axis of the imaging part 14 is perpendicular tothe reference plane of the stage 12. Note that it is also possible thatthe optical axis of the projecting part 13 is set to be perpendicular tothe reference plane, instead of setting the optical axis of the imagingpart 14 to be perpendicular to the reference plane. However, descriptionwill be made hereinbelow by citing a case where the optical axis of theimaging part 14 is perpendicular to the reference plane, as an example.

The stage 12 includes a θ stage 12θ that rotates the object 11 around anaxis parallel to the optical axis of the imaging part 14, an X stage 12Xthat makes the object 11 shift toward a predetermined direction (Xdirection) perpendicular to the optical axis of the imaging part 14, anda Y stage 12Y that makes the object 11 shift toward a predetermineddirection (Y direction) perpendicular to both of the rotation axis ofthe θ stage 12θ and the X direction.

The projecting part 13 is an optical system that illuminates, from adiagonal direction, a part of area (illumination area) on the stage 12,in which an illuminating element 22, a pattern forming part 23, and theprojecting optical system 24 are disposed in this order. Note that asize of the object 11 of the present embodiment is supposed to be smallenough so that the entire object 11 is fitted within the illuminationarea of the projecting part 13, but, even if an object with larger sizeis employed, it is possible to conduct the inspection and measurementwhile moving the stage 12.

The pattern forming part 23 of the projecting part 13 is a panel whosetransmittance or reflectance distribution is variable (atransmission-type liquid crystal element, a reflection-type liquidcrystal element, a DMD (Digital Mirror Device) or the like), and bydisplaying a striped pattern (sinusoidal profile pattern) on the panel,a cross-sectional intensity distribution of luminous flux ofillumination from the pattern forming part 23 toward the object is madeto have a sinusoidal shape. Note that when the reflection-type panel isused, a position of light source is changed, but, the position can beappropriately changed by a person skilled in the art. In the presentembodiment, description will be made by citing a case where thetransmission-type panel is used, as an example. A grating direction ofthe sinusoidal profile pattern displayed on the pattern forming part 23is set to be perpendicular to a plane that includes the optical axis ofthe projecting part 13 and the optical axis of the imaging part 14.Further, a reference point positioned in the vicinity of a center on adisplay surface of the pattern forming part 23 is optically conjugatedto a reference point on the reference plane of the stage 12 (a point ofintersection between the optical axis of the imaging part 14 and theoptical axis of the projecting part 13), and onto a surface of theobject 11 (object surface) disposed within the illumination area of thestage 12, the sinusoidal profile pattern is projected by the projectingoptical system 24. Note that as long as the sinusoidal profile patterncan be projected onto the object surface, there is no problem if thereference point of the pattern forming part 23 and the reference pointof the stage 12 are not in a perfect conjugate relation.

The imaging part 14 is an optical system that detects an image (lightintensity distribution) of illumination area on the stage 12, in whichthe image-forming optical system 25 that forms an image of a patternprojected onto the object surface, on an imaging element 26, and theimaging element 26 that captures the image formed by the image-formingoptical system 25 and obtains the image of the projected pattern, aredisposed in sequence. A reference point positioned in the vicinity of acenter on the imaging plane of the imaging element 26 is opticallyconjugated to the aforementioned reference point of the stage 12, andthe imaging element 26 can obtain an image of the object surface of theobject 11 disposed within the illumination area on the stage 12. Notethat as long as the image of the object surface with sufficient contrastcan be obtained, there is no problem if the reference point of theimaging element 26 and the reference point of the stage 12 are not in aperfect conjugate relation.

Further, there are provided auxiliary light sources 27-1 to 27-8 arounda lens on a stage side of the image-forming optical system 25, and theseauxiliary light sources 27-1 to 27-8 illuminate a field of view of theimage-forming optical system 25 from mutually different directions.

Note that the imaging element 26 has sensitivity with respect to both ofemission wavelengths of these auxiliary light sources 27-1 to 27-8 andan emission wavelength of the light source (reference numeral 21 in FIG.2) of the projecting part 13.

Here, when an image is obtained from the imaging element 26 in a statewhere at least one of the auxiliary light sources 27-1 to 27-8 isswitched on, and the light source (reference numeral 21 in FIG. 2) ofthe projecting part 13 is switched off, an image of object surface ontowhich the sinusoidal profile pattern is not projected (which is an imageincluding light intensity distribution information of the objectsurface) can be obtained. Hereinafter, this image is referred to as“two-dimensional image”.

Further, by repeatedly obtaining the two-dimensional images whileswitching the auxiliary light sources to be switched on among theauxiliary light sources 27-1 to 27-8, it is possible to obtain aplurality of two-dimensional images I₁ to I₈ with different illuminatingdirections (hereinafter, a two-dimensional image obtained by switchingon only the M-th auxiliary light source 27-M is set to “two-dimensionalimage I_(M)”).

Meanwhile, when an image is obtained from the imaging element 26 in astate where all of the auxiliary light sources 27-1 to 27-8 are switchedoff, and the light source (reference numeral 21 in FIG. 2) of theprojecting part 13 is switched on, an image of object surface onto whichthe sinusoidal profile pattern is projected (which is an image includingprofile information of the object surface) can be obtained. Hereinafter,this image is referred to as “striped image”.

Further, by repeatedly obtaining the striped images while shifting aphase of the sinusoidal profile pattern, pieces of information withwhich profile data D of the object surface is made known, are gathered.

FIG. 2 is an entire configuration diagram of the defect inspectingapparatus. In FIG. 2, the same elements as those illustrated in FIG. 1are denoted by the same reference numerals. As illustrated in FIG. 2, tothe projecting part 13, a main light source 21 being a light source ofthe projecting part 13 is coupled. This main light source 21 is used forpattern projection type profile measurement, so that it can employ acommonly-used light source such as, for example, an LED, a halogen lamp,and a metal halide lamp. Light emitted from the main light source 21 isintroduced into the illuminating element 22 via an optical fiber 21′.Note that although an example of using the optical fiber 21′ isdescribed here, it is also possible to dispose the light source such asthe LED at a position indicated by a reference numeral 22 in FIG. 1,without using the optical fiber. It is possible to dispose an arbitraryilluminating element 22 between the LED and the pattern forming part 23.Further, although the illuminating element 22 is illustrated as oneelement, it may also be formed of an illuminating optical system made ofa plurality of optical elements. In such a case, for example, it ispossible to dispose the illuminating optical system using a fly-eyelens, a rod integrator or the like for providing uniform illumination.

This main light source 21, the pattern forming part 23 of the projectingpart 13, the imaging element 26 of the imaging part 14, and theauxiliary light sources 27-1 to 27-8 of the imaging part 14 arerespectively connected to a controlling part 101 of a computer 100.

The controlling part 101 controls a timing of turning on/off (switchingon/off) the main light source 21, the phase of the sinusoidal profilepattern displayed on the pattern forming part 23, a timing of obtainingimage using the imaging element 26, and a timing of turning on/off(switching on/off) each of the auxiliary light sources 27-1 to 27-8.Further, the controlling part 101 can also detect coordinates of thestage 12 (stage coordinates), according to need.

The computer 100 includes, in addition to the controlling part 101, aCPU 15 that comprehensively controls the entire defect inspectingapparatus, a storage part 16, a monitor 17, and an input part 18. In thestorage part 16, an operation program for the CPU 15 is previouslystored, and the CPU 15 operates in accordance with the operationprogram. For example, the CPU 15 drive-controls the respective parts ofthe defect inspecting apparatus by giving various instructions to thecontrolling part 101. Further, for example, the CPU 15 drive-controlsthe respective parts of the defect inspecting apparatus to conductnon-defective/defective judgment of the object 11 based on the obtainedimage.

Further, in the storage part 16, various pieces of information necessaryfor the operation of the CPU 15 are also previously stored, in additionto the aforementioned operation program.

One piece of the information previously stored in the storage part 16includes non-defective (designed shape) product images I_(MR) (M=1 to 8)whose number is the same as the number of types of two-dimensionalimages I_(M) (refer to the right side of FIGS. 8A to 8D). The M-thnon-defective product image I_(MR) corresponds to a non-defectiveproduct image of the M-th two-dimensional image I_(M), and is atwo-dimensional image obtained by placing, instead of the object 11, anon-defective product with the same specification as that of the object11, on the stage 12, and switching on, in that sate, only the M-thauxiliary light source 27-M, for example. Note that the non-defectiveproduct image I_(MR) can also be formed through calculation based ondesign data of the object 11 and design data of the defect inspectingapparatus.

Further, one piece of the information previously stored in the storagepart 16 includes non-defective profile data D_(R) (refer to the rightside of FIG. 9 to be described later). The non-defective profile dataD_(R) corresponds to non-defective product data of the profile data D,and is profile data obtained in a state where a non-defective productwith the same specification as that of the object 11, instead of theobject 11, is placed on the stage 12, for example. Note that thenon-defective profile data D_(R) can also be formed through calculationbased on the design data of the object 11 and the design data of thedefect inspecting apparatus.

FIG. 3A is a diagram in which the auxiliary light sources 27-1 to 27-8and the image-forming optical system 25 are seen from a side of thestage 12. As illustrated in FIG. 3A, the auxiliary light sources 27-1 to27-8 are surface light sources disposed at even intervals around thelens on the stage side of the image-forming optical system 25, andspecifications thereof are substantially common to one another.

An optical axis of each of the auxiliary light sources 27-1 to 27-8 isinclined by a predetermined angle with respect to an optical axis of theimage-forming optical system 25, and intersects the optical axis of theimage-forming optical system 25 on a reference plane 11P of the stage12, as illustrated in FIG. 4A. Note that a position of the intersectionis substantially the same as a position at which the optical axis of theprojecting part 13 and the optical axis of the imaging part 14intersect.

Further, as illustrated in FIG. 3A, each of the auxiliary light sources27-1 to 27-8 has a plurality of cannonball-shaped type LEDstwo-dimensionally and densely arranged thereon, thereby forming thesurface light source. A tip of the cannonball-shaped type LED has ashape which can function as lens, and light emitted from each of theLEDs illuminates a measuring plane. In an illumination area formed onthe stage 12 by each of such auxiliary light sources 27-1 to 27-8,illuminance becomes substantially uniform.

Note that since FIG. 3A is a schematic diagram, the number of LEDsarranged on each of the auxiliary light sources 27-1 to 27-8 is notalways the same number as that illustrated in FIG. 3A. However, as thenumber becomes larger, it is possible to broaden the area with highilluminance uniformity.

Note that it is possible to employ a configuration such that eightauxiliary light sources 27 a-1 to 27 a-8 are disposed around theimage-forming optical system 25, as illustrated in FIG. 3B, instead ofdensely disposing the plurality of LEDs. As the light sources, varioustypes of light sources, other than the LEDs, can be used.

Further, it is also possible to employ a configuration in which onecircular ring-shaped auxiliary light source 27 b is disposed, asillustrated in FIG. 3C, although the switching of the plurality of lightsources cannot be made. In this case, although one light source is used,it is possible to illuminate the object surface from a plurality ofdirections at the same time.

Further, although not illustrated, it is also possible to employ aconfiguration in which a beam splitter is used to performepi-illumination. In the present embodiment, the number of the pluralityof light sources is set to 8, but, it is also possible to dispose thelight sources whose number is smaller or larger than 8.

Further, it is also possible to employ a configuration in which anilluminating optical system 32 is separately disposed between theauxiliary light source 27 and the object surface 11, as illustrated inFIG. 4B. In this case, it is possible to use, not the cannonball-typeLED, but another LED as the auxiliary light source 27.

Further, each of the auxiliary light sources 27-1 to 27-8 is used forthe light intensity distribution measurement (obtainment oftwo-dimensional image), so that it is possible to apply a white LED orthe like, for example, as each LED.

FIG. 5 is a flow chart of the defect inspecting processing performed bythe CPU 15. Hereinafter, respective steps in FIG. 5 will be described inorder.

Step S1: The CPU 15 executes light intensity distribution measuringprocessing illustrated in FIG. 6 to obtain a plurality oftwo-dimensional images I₁ to I₈ with mutually different illuminatingdirections, and stores the images in the storage part 16. Note thatdetails of FIG. 6 will be described later.

Step S2: The CPU 15 sets an image number M to an initial value (1).

Step S3: The CPU 15 reads the M-th two-dimensional image I_(M) and theM-th non-defective product image I_(MR) from the storage part 16, andcalculates an evaluating value indicating a correlation degree of thesetwo images (refer to FIGS. 8A to 8D).

Note that when calculating the evaluating value, the CPU 15 performspreprocessing (rotation processing, shift processing or the like, forexample) on at least one of the two-dimensional image I_(M) and thenon-defective product image I_(MR), thereby aligning an area ofdistribution of the two-dimensional image I_(M) and an area ofdistribution of the non-defective product image I_(MR).

Further, the calculation of the evaluating value may be conducted foreach partial area of the two-dimensional image I_(M) and thenon-defective product image I_(MR), or may also be conducted withrespect to the whole area, but, in this case, the calculation is set tobe conducted with respect to the whole area, for the sake ofsimplification.

Step S4: The CPU 15 compares the evaluating value calculated in step S3with a threshold value, in which when the evaluating value is less thanthe threshold value, the CPU 15 immediately judges that the object 11 isbelow standard, and the process proceeds to step S11, and when theevaluating value is equal to or greater than the threshold value, theCPU 15 judges that there remains a possibility that the object 11 iswithin standard, and the process proceeds to step S5.

Step S5: The CPU 15 judges whether or not the image number M reaches afinal value M_(max), in which when the number does not reach the value,the process proceeds to step S6, and when the number reaches the value,the process proceeds to step S7. Note that since the number of auxiliarylight sources is set to “8” in this case, the final value M_(max) alsobecomes “8”.

Step S6: The CPU 15 increments the image number M, and the processreturns to step S3. Therefore, the CPU 15 repeats the comparison betweenthe two-dimensional image and the non-defective product image(calculation of evaluating value) as in FIGS. 8A, 8B, 8C, . . . until itjudges that the object 11 is below standard, or the image number Mreaches “8”.

Step S7: The CPU 15 executes profile measuring processing illustrated inFIG. 7 to obtain profile data D of the object surface, and stores thedata in the storage part 16. Note that details of FIG. 7 will bedescribed later.

Step S8: The CPU 15 reads the profile data D and the non-defectiveprofile data D_(R) from the storage part 16, and calculates anevaluating value indicating a correlation degree of these two pieces ofdata (refer to FIG. 9).

Note that when calculating the evaluating value, the CPU 15 performspreprocessing (rotation processing, shift processing or the like, forexample) on at least one of the profile data D and the non-defectiveprofile data D_(R), thereby aligning an area of distribution of theprofile data D and an area of distribution of the non-defective profiledata D_(R).

Further, the calculation of evaluating value may be conducted for eachpart of the profile data D and the non-defective profile data D_(R), ormay also be conducted with respect to the entire data, but, in thiscase, the calculation is set to be conducted with respect to the entiredata, for the sake of simplification.

Further, as the evaluating value, it is also possible to use, other thanthe evaluating value indicating the correlation degree, a value obtainedby quantifying a depth or a volume of a defective portion determinedfrom a difference between the profile data and the non-defective profiledata, or the like.

Step S9: The CPU 15 compares the evaluating value calculated in step S8with a threshold value, in which when the evaluating value is less thanthe threshold value, the CPU 15 judges that the object 11 is belowstandard, and the process proceeds to step S11, and when the evaluatingvalue is equal to or greater than the threshold value, the CPU 15 judgesthat the object 11 is within standard, and the process proceeds to stepS10. Note that it is set that the threshold value used in the presentstep is previously stored in the storage part 16.

Step S10: The CPU 15 displays an inspection result indicating that theobject 11 is a non-defective product, on the monitor 17, and terminatesthe flow.

Step S11: The CPU 15 displays an inspection result indicating that theobject 11 is a defective product, on the monitor 17, and terminates theflow.

As described above, the defect inspecting apparatus of the presentembodiment measures both of the light intensity distribution of theobject surface and the profile of the object surface, and makes judgmentthat the object 11 is the non-defective product only when both of thelight intensity distribution and the profile are within standard, sothat it has a high inspection accuracy compared to a case where only thelight intensity distribution is measured, or only the profile ismeasured.

Besides, the defect inspecting apparatus of the present embodimentilluminates the object surface from the mutually different pluraldirections when measuring the light intensity distribution, so that itis possible to detect a defect regarding a texture of the objectsurface, without being influenced by the profile of the object surface.Further, since such illumination can emphasize the defect, it ispossible to securely detect even a small defect (incidentally, when theilluminating direction is set to only one direction, there is generateda portion to be shaded on the object surface, resulting in that a defectregarding a texture of that portion may be failed to be noticed).

Further, since the defect inspecting apparatus of the present embodimentuses the image-forming optical system 25 and the imaging element 26 incommon for the light intensity distribution measurement and the profilemeasurement, it is possible to achieve the improvement in inspectionaccuracy while suppressing an increase in the number of parts.

In the aforementioned embodiment, the stage 12 is disposed as the defectinspecting apparatus or the three-dimensional profile measuringapparatus, but, the apparatus can also be configured as a so-calledportable apparatus so that the apparatus can be freely moved withrespect to the measuring object. In this case, the stage 12 is notnecessary, and it is only required to configure such that a chassis 30illustrated in FIG. 1 is separated from a support member 31 to enablethe free movement of the chassis 30.

In the aforementioned embodiment, the light sources with differentwavelengths are used as the light source 21 and the light source 27, sothat if a configuration in which the image can be obtained by separatingthe wavelengths is employed, it is possible to simultaneously conductthe obtainment of the two-dimensional image and the three-dimensionalprofile measurement. Further, it is also possible to make thewavelengths of the two light sources to be the same.

[Light Intensity Distribution Measuring Processing]

FIG. 6 is a flow chart of the light intensity distribution measuringprocessing performed by the CPU 15. Hereinafter, respective steps inFIG. 6 will be described in order.

Step S111: The CPU 15 sets an image number M to an initial value (1).

Step S112: The CPU 15 instructs the controlling part 101 to turn on theM-th auxiliary light source 27-M. The controlling part 101 turns on theM-th auxiliary light source 27-M, and keeps an off-state of the otherauxiliary light sources and the main light source 21.

Step S113: The CPU 15 instructs the controlling part 101 to obtain animage. The controlling part 101 drives the imaging element 26 to obtainthe two-dimensional image I_(M) corresponding to one frame, andtransmits the two-dimensional image I_(M) to the CPU 15.

Step S114: The CPU 15 instructs the controlling part 101 to turn off theM-th auxiliary light source 27-M. The controlling part 101 turns off theM-th auxiliary light source 27-M, and keeps an off-state of the otherauxiliary light sources and the main light source 21.

Step S115: The CPU 15 judges whether or not the image number M reaches afinal value M_(max) (“8”, in this case), in which when the number doesnot reach the value, the process proceeds to step S116, and when thenumber reaches the value, the flow is terminated.

Step S116: The CPU 15 increments the image number M, and the processreturns to step S112. Therefore, the CPU 15 repeats the obtainment oftwo-dimensional images I_(M) eight times while switching the auxiliarylight sources to be switched on, thereby obtaining eight pieces oftwo-dimensional images I₁ to I₈ with mutually different illuminatingdirections.

Note that in the above-described explanation, all of the plurality oflight sources are set to independently provide illumination, but, it isalso possible to conduct the inspection and the measurement by usingonly an arbitrary light source among the plurality of light sources.Further, it is also possible to make the plurality of light sources emitlight at the same time. Because of the illumination from differentdirections, small flaws and holes are emphasized, so that it becomespossible to detect the flaws and holes more easily through theobtainment of two-dimensional image. It becomes possible to check theflaws and holes simultaneously with the performance of the profilemeasurement (three-dimensional profile measurement). In this case, thedefect inspection does not always have to be conducted, and it isrequired to perform only the detection of flaws, holes and the like, inaddition to the three-dimensional profile measurement (profilemeasurement).

[Profile Measuring Processing]

FIG. 7 is a flow chart of the profile measuring processing performed bythe CPU 15. Hereinafter, respective steps in FIG. 7 will be described inorder.

Step S71: The CPU 15 sets a phase number m to an initial value (1).

Step S72: The CPU 15 instructs the controlling part 101 to turn on themain light source 21. The controlling part 101 turns on the main lightsource 21, and keeps an off-state of the auxiliary light sources 27-1 to27-8.

Step S73: The CPU 15 instructs the controlling part 101 to set a phaseof the sinusoidal profile pattern to a value represented by (m−1)π/2.The controlling part 101 sets the phase of the sinusoidal profilepattern displayed on the pattern forming part 23 to (m−1)π/2.

Step S74: The CPU 15 instructs the controlling part 101 to obtain animage. The controlling part 101 drives the imaging element 26 to obtaina striped image I_(Sm) corresponding to one frame, and transmits thestriped image I_(Sm) to the CPU 15.

Step S75: The CPU 15 judges whether or not the phase number m reaches afinal value m_(max) (which is set to “4”, in this case), in which whenthe number does not reach the value, the process proceeds to step S76,and when the number reaches the value, the process proceeds to step S77.

Step S76: The CPU 15 increments the phase number m, and the processreturns to step S73. Therefore, the CPU 15 repeats the obtainment ofstriped images I_(Sm) four times while shifting the phase of thesinusoidal profile pattern by π/2, thereby obtaining a plurality ofstriped images I_(S1) to I_(S4) with mutually different phases.

Step S77: The CPU 15 instructs the controlling part 101 to turn off themain light source 21. The controlling part 101 turns off the main lightsource 21, and keeps an off-state of the auxiliary light sources 27-1 to27-8.

Step S78: The CPU 15 sets a pixel number i to an initial value (1), whenanalyzing the striped images I_(S1) to I_(S4).

Step S79: The CPU 15 refers to a series of pixel values I_(S1i) toI_(S4i) regarding i-th pixels in the striped images I_(S1) to I_(S4),and applies the values to the following expression, thereby calculatinga value of initial phase φ_(i) of the i-th pixels.

$\begin{matrix}{\varphi_{i} = {\tan^{- 1}\frac{I_{S\; 4i} - I_{S\; 2i}}{I_{S\; 1i} - I_{S\; 3i}}}} & \lbrack {{Mathematical}\mspace{14mu} {expression}\mspace{14mu} 1} \rbrack\end{matrix}$

Step S791: The CPU 15 judges whether or not the pixel number i reaches afinal value i_(max), in which when the number does not reach the value,the process proceeds to step S792, and when the number reaches thevalue, the process proceeds to step S793. Note that the final valuei_(max) of the pixel number i indicates the number of pixels of theimaging element used for obtaining the striped image, and is representedby i_(max)=200×200=40000, for example.

Step S792: The CPU 15 increments the pixel number i, and the processreturns to step S79. Therefore, the CPU 15 calculates each value of theinitial phase φ_(i) with respect to all pixel numbers i (i=1 to 40000).

Step S793: The CPU 15 arranges the values of initial phase φ_(i)calculated in the above-described step, in the order of pixel numbers,to obtain a phase distribution, and applies unwrapping processing (whichis phase unwrapping processing of adding an offset distribution) to thephase distribution. Note that the offset distribution used in theunwrapping processing is determined by the design data of the defectinspecting apparatus, and is a value previously stored in the storagepart 16. After that, the CPU 15 converts the phase distribution afterbeing subjected to the unwrapping processing into height distributiondata (profile data D) of the object surface.

In the above-described explanation, a method called as a phase shiftmethod is used as the pattern projection method, in which the number ofobtainment of striped images is not limited to 4, it is possible toconduct the profile measurement using the striped images whose number islarger (or smaller) than 4, such as 5, 7, 9, 11 or the like, and it ispossible to appropriately use a well-known method.

[Supplements to the First Embodiment]

Note that the defect inspecting apparatus of the first embodimentperforms the judgment based on the light intensity distribution (stepsS1 to S6) first, and after that, it performs the judgment based on theprofile (steps S7 to S9), but, it is also possible to reverse the orderof the judgment.

Further, although it is set that the defect inspecting apparatus of thefirst embodiment performs the judgment based on the light intensitydistribution (steps S1 to S6) and the judgment based on the profile(steps S7 to S9) in sequence, and when the result of the former judgmentbecomes “below standard”, the apparatus immediately regards that theobject 11 is the defective product without performing the latterjudgment, it is also possible to make modification as follows.

Specifically, it is also possible to design such that the defectinspecting apparatus of the first embodiment calculates both of theevaluating value based on the light intensity distribution and theevaluating value based on the profile, and then performsnon-defective/defective judgment (comprehensive judgment) of the object11 based on both of those evaluating values. Note that the comprehensivejudgment can be performed by, for example, comparing a weighting averagevalue of a plurality of evaluating values with a previously preparedthreshold value, or the like.

Second Embodiment

Hereinafter, a defect inspecting apparatus will be described as a secondembodiment of the present invention. The defect inspecting apparatus ofthe present embodiment is also used for the defect inspection of theindustrial product or the industrial part, similar to the defectinspecting apparatus of the first embodiment, and is particularlyeffective when the size of the object 11 is large. Here, only a point ofdifference from the defect inspecting apparatus of the first embodimentwill be described.

FIG. 10 is a perspective view illustrating a mechanical configuration ofthe defect inspecting apparatus of the present embodiment, and FIG. 11is an entire configuration diagram of the defect inspecting apparatus ofthe present embodiment. In FIG. 10, the same elements as those of FIG. 1are denoted by the same reference numerals, and in FIG. 11, the sameelements as those of FIG. 2 are denoted by the same reference numerals.

As illustrated in FIG. 10 and FIG. 11, an imaging part 14′ of the defectinspecting apparatus of the present embodiment does not includeauxiliary light sources, and, instead of that, an imaging part 200dedicated to the detection of two-dimensional image is providedseparately from the imaging part 14′. Accordingly, the projecting part13 and the imaging part 14′ serve as an optical system dedicated to theprofile measurement.

A field of view of the imaging part 200 (which is an area on the stage12 capable of being detected by the imaging part 200) is larger than afield of view of the imaging part 14′ (which is an area on the stage 12capable of being detected by the imaging part 14′), and even the wholeobject 11 with a size which is too large to be fitted in the field ofview of the imaging part 14′, can be captured by the field of view ofthe imaging part 200.

An optical axis of the imaging part 200 is parallel to an optical axisof the imaging part 14′, and is set to a position separated from theoptical axis of the imaging part 14′ by a predetermined distance. Thepredetermined distance is set large enough so that the field of view ofthe imaging part 14′ (area on the stage 12 from which the striped imagecan be formed) is separated from the field of view of the imaging part200 (area on the stage 12 from which the two-dimensional image can beformed).

Note that in FIG. 10 and FIG. 11, it is supposed that the optical axisof the imaging part 200 exists on the same plane as that on which theoptical axis of the imaging part 14′ and the optical axis of theprojecting part 13 exist, and a direction from the optical axis of theimaging part 14′ toward the optical axis of the imaging part 200 issupposed to be “Y direction”.

Note that in this case, when switching the measurement methods betweenthe profile measurement and the light intensity distributionmeasurement, the defect inspecting apparatus of the present embodimentis only required to drive the Y stage 12Y to move the object 11 to the Ydirection by an amount of deviation between the optical axes describedabove. Accordingly, it is set that the storage part 16 of the presentembodiment previously stores information regarding a stage movementamount (stage offset) required for switching the measurement methods.

Meanwhile, in the imaging part 200, an image-forming optical system 202that forms an image of reflected light generated at the stage 12, and animaging element 201 that captures an image formed by the image-formingoptical system 202 to obtain an image, are disposed in sequence.

Out of the above, the imaging element 201 has an imaging plane which isoptically conjugated to the reference plane of the stage 12.Accordingly, the imaging element 201 can obtain an image of objectsurface of the object 11 disposed in the vicinity of the optical axis ofthe imaging part 200, out of the stage 12.

Further, there are provided auxiliary light sources 203-1 to 203-8around a lens on the stage 12 side of the image-forming optical system202, and these auxiliary light sources 203-1 to 203-8 can illuminate afield of view of the image-forming optical system 202 from mutuallydifferent directions.

Note that a function of the auxiliary light sources 203-1 to 203-8 withrespect to the image-forming optical system 202 in the presentembodiment is the same as the function of the auxiliary light sources27-1 to 27-8 with respect to the image-forming optical system 25 in thefirst embodiment, and modified examples of the auxiliary light sourcesin the present embodiment are also similar to those in the firstembodiment, so that explanation will be omitted here.

However, a diameter of the image-forming optical system 202 to which theauxiliary light sources 203-1 to 203-8 in the present embodiment areprovided is larger than a diameter of the image-forming optical system25 to which the auxiliary light sources 27-1 to 27-8 in the firstembodiment are provided, so that a size of each of the auxiliary lightsources 203-1 to 203-8 in the present embodiment is desirable to belarger than a size of each of the auxiliary light sources 27-1 to 27-8in the first embodiment.

Note that it is also possible that, instead of increasing the size ofeach of the auxiliary light sources in the present embodiment, thenumber of auxiliary light sources in the present embodiment is set to belarger than the number of auxiliary light sources in the firstembodiment. However, in the description hereinbelow, it is assumed thatthe number of auxiliary light sources in the present embodiment is thesame as the number of auxiliary light sources in the first embodiment,for the sake of simplification.

Further, the imaging element 201 of the imaging part 200 is onlyrequired to have at least sensitivity with respect to emissionwavelengths of the auxiliary light sources 203-1 to 203-8. Meanwhile,the imaging element 26 of the imaging part 14′ is only required to haveat least sensitivity with respect to an emission wavelength of the lightsource (main light source 21) of the projecting part 13.

FIG. 12 and FIG. 13 are flow charts of defect inspecting processingperformed by the CPU 15 of the present embodiment. Hereinafter,respective steps in FIG. 12 and FIG. 13 will be described in order. Notethat at a time point at which the defect inspecting processing isstarted, it is set that the stage 12 is stopped at a position at whichthe object 11 is fitted within the field of view of the imaging part200.

Step S1: The CPU 15 executes light intensity distribution measuringprocessing illustrated in FIG. 6 to obtain a plurality oftwo-dimensional images I₁ to I₈ with mutually different illuminatingdirections, and stores the images in the storage part 16. Note that inthe light intensity distribution measuring processing of the presentembodiment, the imaging element 201 is driven, instead of driving theimaging element 26, and the auxiliary light sources 203-1 to 203-8 aredriven, instead of driving the auxiliary light sources 27-1 to 27-8.

Step S2: The CPU 15 sets an image number M to an initial value (1).

Step S3: The CPU 15 reads the M-th two-dimensional image I_(M) and theM-th non-defective product image I_(MR) from the storage part 16, andperforms preprocessing (rotation processing, shift processing or thelike, for example) on at least one of the two-dimensional image I_(M)and the non-defective product image I_(MR), thereby aligning an area ofdistribution of the two-dimensional image I_(M) and an area ofdistribution of the non-defective product image I_(MR).

Subsequently, the CPU 15 sets a target pixel P on each of the processedtwo-dimensional image I_(M) and non-defective product image I_(MR) asillustrated in FIG. 14, sets each local area A (square area of severalpixels×several pixels, for instance) in which the target pixel P is setas a center, and calculates a correlation degree between the local areaA in the two-dimensional image I_(M) and the same area A in thenon-defective product image I_(MR), as an evaluating value regarding thetarget pixel P of the two-dimensional image I_(M).

Further, the CPU 15 repeatedly calculates the evaluating value as abovewhile shifting the position of the target pixel P on the two-dimensionalimage I_(M), to thereby calculate the evaluating value for each pixel ofthe two-dimensional image I_(M).

Step S101: The CPU 15 compares the evaluating value of each pixelcalculated in step S3 with each threshold value, and picks upcoordinates of pixel (pixel coordinates) whose evaluating value is lessthan the threshold value, as defect option coordinates (refer to FIG.15A).

Step S5: The CPU 15 judges whether or not the image number M reaches afinal value M_(max), in which when the number does not reach the value,the process proceeds to step S6, and when the number reaches the value,the process proceeds to step S102.

Step S6: The CPU 15 increments the image number M, and the processreturns to step S3. Therefore, the CPU 15 repeats the pick-up of thedefect option coordinates (step S3) until the image number M reaches“8”. Accordingly, the defect option coordinates are accumulated.

Step S102: The CPU 15 refers to all of the defect option coordinatespicked up in the above-described step, determines a minimum number ofrectangular frames required for surrounding all of those defect optioncoordinates on a coordinate space, and sets the number to a final valuen_(max) of measurement number n (refer to FIG. 15B). Note that a size ofthe rectangular frame supposed in the present step is set to the samesize as a size of projected image obtained when the image-formingoptical system 202 projects, on the imaging element 201, an object withthe same size as that of the field of view of the imaging part 14′.

Further, the measurement numbers n=1 to n_(max) are labeled, by the CPU15, with respect to one or a plurality of rectangular frames requiredfor surrounding all of those defect option coordinates (refer to FIG.15C), and the CPU 15 determines center coordinates of respective n_(max)pieces of rectangular frames B₁ to B_(nmax), as measured coordinatesc_(n) to c_(nmax), and stores the coordinates in the storage part 16.

Step S103: The CPU 15 judges whether or not a value of the final valuen_(max) determined in step S102 is zero, in which when the value iszero, the CPU 15 immediately judges that there is no possibility thatthe object 11 is below standard, and the process proceeds to step S10,and when the value is not zero, the CPU 15 judges that there is apossibility that the object 11 is below standard, and the processproceeds to step S104.

Step S104: The CPU 15 reads, in order to switch the measurement methods,the information regarding the stage offset from the storage part 16, andgives, to the controlling part 101, an instruction of moving the stage,together with the stage offset. Under the instruction of the controllingpart 101, the stage 12 makes the object 11 shift by the stage offset,thereby making a part, out of the object 11, which was positioned on theoptical axis of the imaging part 200, to be positioned on the opticalaxis of the imaging part 14′. Hereinafter, the stage 12 is set to bedriven by setting stage coordinates under this state as a reference(origin).

Step S105: The CPU 15 sets the measurement number n to an initial value(1).

Step S106: The CPU 15 reads the n-th measured coordinates c_(n) from thestorage part 16, and calculates target values of the stage coordinatesrequired for disposing a part, out of the object surface, correspondingto the measured coordinates c_(n), on the optical axis of the imagingpart 14′ (this calculation is conducted based on the measuredcoordinates c_(n) and the design data of the defect inspectingapparatus). Subsequently, the CPU 15 gives, to the controlling part 101,an instruction of moving the stage, together with the calculated targetvalues. Under the instruction of the controlling part 101, the stage 12makes the object 11 shift so that the stage coordinates become thetarget values.

Step S7: The CPU 15 executes profile measuring processing illustrated inFIG. 7 to obtain profile data D regarding a part, out of the objectsurface, captured by the field of view of the imaging part 14′, andstores the data in the storage part 16. The profile data D is profiledata regarding a part, out of the object surface, corresponding to themeasured coordinates c_(n). The data is referred to as “partial profiledata D_(n)”, hereinafter.

Step S107: The CPU 15 judges whether or not the measurement number nreaches the final value n_(max), in which when the number does not reachthe value, the process proceeds to step S108, and when the numberreaches the value, the process proceeds to step S8.

Step S108: The CPU 15 increments the measurement number n, and theprocess returns to step S106. Therefore, the CPU 15 obtains one piece ora plurality of pieces of partial profile data D₁ to D_(n) regarding theobject surface.

Step S8: The CPU 15 reads the partial profile data D₁ to D_(n) and thenon-defective profile data D_(R) from the storage part 16, and arrangesthe partial profile data D₁ to D_(n) based on a positional relation ofthe measured coordinates c₁ to c_(n), thereby forming entire profiledata D of the object 11. However, the profile data D may have a missingportion. Subsequently, the CPU 15 performs preprocessing (rotationprocessing, shift processing, enlargement/reduction processing or thelike, for example) on at least one of the formed profile data D and thenon-defective profile data D_(R), thereby aligning an area ofdistribution of the profile data D and an area of distribution of thenon-defective profile data D_(R).

Further, the CPU 15 calculates an evaluating value indicating acorrelation degree between data, out of the non-defective profile dataD_(R), indicating a profile of the part corresponding to the partialprofile data D₁, and the partial profile data D₁. This evaluating valueis an evaluating value of the partial profile data D₁. Further, the CPU15 calculates the evaluating value as above with respect to each of thepieces of partial profile data D₂ to D_(n), in a similar manner.Accordingly, the evaluating value of each of the pieces of partialprofile data D₁ to D_(n) is calculated.

Note that in the present step, the pieces of partial profile data D₂ toD_(n) are joined together to form the profile data D, and then theevaluating value is calculated, but, it is also possible to design suchthat each of the pieces of partial profile data D₂ to D_(n) and thecorresponding part of the non-defective profile data D_(R) are directlycompared to calculate the evaluating value.

Further, in the present step, the evaluating value is calculated foreach part (for each partial profile data) of the object surface, but, itis also possible to calculate the evaluating value for the entireprofile data D. However, in the explanation hereinbelow, it is assumedthat the evaluating value is calculated for each part (for each partialprofile data) of the object surface.

Further, as the evaluating value, it is also possible to use, other thanthe evaluating value indicating the correlation degree, a value obtainedby quantifying a depth or a volume of a defective portion determinedfrom a difference between the profile data (or the partial profile data)and the non-defective profile data, or the like.

Step S9: The CPU 15 compares the evaluating value calculated in step S8with each threshold value, in which when there exists the evaluatingvalue which is less than the threshold value, the CPU 15 judges that theobject 11 is below standard, and the process proceeds to step S11, andwhen there exists no evaluating value which is less than the thresholdvalue, the CPU 15 judges that the object 11 is within standard, and theprocess proceeds to step S10.

Step S10: The CPU 15 displays an inspection result indicating that theobject 11 is a non-defective product, on the monitor 17, and terminatesthe flow.

Step S11: The CPU 15 displays an inspection result indicating that theobject 11 is a defective product, on the monitor 17, and terminates theflow.

As described above, the defect inspecting apparatus of the presentembodiment sets the field of view in the light intensity distributionmeasurement to be larger than the field of view in the profilemeasurement, so that it is possible to set the resolution in the profilemeasurement to be higher than the resolution in the light intensitydistribution measurement. Further, in the defect inspecting apparatus ofthe present embodiment, the part, out of the object 11, which was notregarded as the defect option in the tentative judgment based on thelight intensity distribution, is excluded from the object of the profilemeasurement. Therefore, the judgment based on the profile measurement(specifically, judgment with comparatively high accuracy) is efficientlyconducted.

Next, description will be made on a structure manufacturing systemincluding the three-dimensional profile measuring apparatus, and theinspecting apparatus according to the first embodiment or the secondembodiment.

FIG. 16 is a block configuration diagram of a structure manufacturingsystem 200. The structure manufacturing system 200 is configured byincluding a three-dimensional profile measuring apparatus 1, a designingapparatus 210, a forming apparatus 220, a controlling apparatus 230, anda repair apparatus 240.

The designing apparatus 210 produces design information regarding aprofile of structure, and transmits the produced design information tothe forming apparatus 220. Further, the designing apparatus 210 makes alater-described coordinate storage part 231 of the controlling apparatus230 store the formed design information. Here, the design informationcorresponds to information indicating coordinates of respectivepositions of the structure, for example.

The forming apparatus 220 manufactures the aforementioned structure,based on the design information input from the designing apparatus 210.A forming process of the forming apparatus 220 includes casting,forging, cutting or the like.

The three-dimensional profile measuring apparatus 1 measures coordinates(three-dimensional profile) of the aforementioned manufactured structure(measuring object 11), as described in the first embodiment, andtransmits information indicating the measured coordinates (profileinformation) to the controlling apparatus 230.

The controlling apparatus 230 includes the coordinate storage part 231and an inspecting part 232. In the coordinate storage part 231, thedesign information received from the designing apparatus 210 is stored,as described above. The inspecting part 232 reads the design informationfrom the coordinate storage part 231, and compares the informationindicating the coordinates (profile information) received from thethree-dimensional profile measuring apparatus 1 and the designinformation read from the coordinate storage part 231.

Further, the inspecting part 232 judges, based on the comparison result,whether or not the structure is formed in accordance with the designinformation. In other words, the inspecting part 232 judges whether ornot the formed structure is a non-defective product. Further, when thestructure is not formed in accordance with the design information, theinspecting part 232 judges whether or not the repair can be made. Whenthe repair can be made, the inspecting part 232 calculates a defectiveportion and a repair amount based on the comparison result, andtransmits information indicating the defective portion and informationindicating the repair amount, to the repair apparatus 240.

Further, when the apparatus of the present embodiment is used as theinspecting apparatus, it is also possible to conduct thenon-defective/defective judgment by using only the defect inspectionbased on the two-dimensional image or by using the above-describedinspection and the defect inspection in a combined manner.

The repair apparatus 240 performs processing on the defective portion ofthe structure, based on the information indicating the defective portionand the information indicating the repair amount received from thecontrolling apparatus 230.

FIG. 17 is a flow chart illustrating a flow of processing performed bythe structure manufacturing system 200.

First, in step S401, the designing apparatus 210 produces the designinformation regarding the profile of the structure. Next, in step S402,the forming apparatus 220 manufactures the aforementioned structurebased on the design information. Next, in step S403, thethree-dimensional profile measuring apparatus 1 measures the profile ofthe above-described manufactured structure. Next, in step S404, theinspecting part 232 of the controlling apparatus 230 compares theprofile information obtained by the three-dimensional profile measuringapparatus 1 and the aforementioned design information, to therebyinspect whether or not the structure is formed in accordance with thedesign information.

Next, in step S405, the inspecting part 232 of the controlling apparatus230 judges whether or not the formed structure is a non-defectiveproduct. Further, when the formed structure is the non-defectiveproduct, the structure manufacturing system 200 terminates itsprocessing. On the other hand, when the formed structure is not thenon-defective product, the process proceeds to step S406.

Note that when the judgment is made only by the non-defective/defectivejudgment of defect based on the two-dimensional image described above,the process is terminated after step S405.

In step S406, the inspecting part 232 of the controlling apparatus 230judges whether or not the formed structure can be repaired. When theformed structure can be repaired, the process proceeds to step S407, andwhen the formed structure cannot be repaired, the structuremanufacturing system 200 terminates its processing. In step S407, therepair apparatus 240 performs reprocessing of the structure, and theprocess returns to the processing in step S403.

Through the processing described above, the structure manufacturingsystem 200 can judge whether or not the formed structure is thenon-defective product. Further, when the structure is not thenon-defective product, the structure manufacturing system 200 can repairthe structure by performing the reprocessing of the structure.

Note that the repair process executed by the repair apparatus 240 in thepresent embodiment can also be replaced with a process in which theforming apparatus 220 re-executes the forming process. At that time,when the inspecting part 232 of the controlling apparatus 230 judgesthat the repair can be made, the forming apparatus 220 re-executes theforming process (forging, cutting or the like). Concretely, for example,the forming apparatus 220 performs cutting on a portion, in thestructure, which should be originally cut but is not. Accordingly, thestructure manufacturing system 200 can accurately form the structure.

Further, it is also possible to perform the three-dimensional profilemeasuring processing by recording a program for realizing the respectivesteps described in the aforementioned profile measuring processing in acomputer-readable recording medium, making a computer system read theprogram recorded in the recording medium, and executing the program.Note that the “computer system” mentioned here may be one which includeshardware such as OS and peripheral devices.

Further, it is set that the “computer system” includes a homepageproviding environment (or display environment) when it uses a WWWsystem.

Further, the “computer readable recording medium” means a portablemedium such as a flexible disk, a magneto-optical disk, a ROM, awritable nonvolatile memory such as a flash memory, and a CD-ROM, and astorage device such as a hard disk built in a computer system.

Further, it is set that the “computer readable storage medium” includesone which keeps a program for a fixed time, such as a volatile memory(DRAM (Dynamic Random Access Memory), for example) inside computersystems which become a server and a client when the program istransmitted via a network such as the Internet, and a communication linesuch as a telephone line.

Further, the above-described program may be transmitted to anothercomputer system via a transmission medium or by a transmission wave inthe transmission medium from the computer system storing this program inthe storage device and the like. Here, the “transmission medium” fortransmitting the program indicates a medium having a function oftransmitting information as a network (communication network) such asthe Internet and a communication line (line of communication) such as atelephone line.

Further, the above-described program may be one for realizing a part ofthe aforementioned function. Further, the program may also be one whichcan realize the aforementioned function by the combination with theprogram already recorded in the computer system, which is, a so-calleddifferential file (differential program).

Although one embodiment of this invention has been described above indetail with reference to the drawings, the concrete configuration is notlimited to the above-described configuration, and various changes ofdesign and the like can be made within a scope that does not depart fromthe gist of the invention.

[Supplements to the Respective Embodiments]

Note that the defect inspecting apparatus of any one of the embodimentsdescribed above obtains the plurality of two-dimensional images I₁ to I₈with different illuminating directions as the light intensitydistribution of the object surface, but, it may also obtain one piece oftwo-dimensional image I_(all) in which the illuminating directions areset to all directions, instead of the two-dimensional images I₁ to I₈.This two-dimensional image I_(all) corresponds to a two-dimensionalimage obtained in a state where all of the auxiliary light sources 27-1to 27-8 are switched on at the same time. Note that in that case, thedefect inspecting apparatus previously prepares a non-defective productimage of the two-dimensional image I_(all), and compares thenon-defective product image and the two-dimensional image l_(all), tothereby calculate an evaluating value regarding the two-dimensionalimage I_(all).

Further, the defect inspecting apparatus of any one of the embodimentsdescribed above obtains the plurality of two-dimensional images I₁ to I₈with different illuminating directions as the light intensitydistribution of the object surface, but, it may also obtain one piece oftwo-dimensional image I_(all) in which the illuminating directions areset to all directions, in addition to the two-dimensional images I₁ toI₈. Note that in that case, the defect inspecting apparatus calculatesboth of the evaluating values regarding the two-dimensional images I₁ toI₈, and an evaluating value regarding the two-dimensional image I_(all).

Further, the defect inspecting apparatus of any one of the embodimentsdescribed above obtains the plurality of two-dimensional images I₁ to I₈with different illuminating directions as the light intensitydistribution of the object surface, but, it may also obtain a pluralityof two-dimensional images each having a different combination ofilluminating direction and illumination wavelength. Note that in thatcase, the defect inspecting apparatus is only required to prepare aplurality of non-defective product images each having a differentcombination of illuminating direction and illumination wavelength, asthe plurality of non-defective product images.

Further, in the defect inspecting apparatus of any one of theembodiments described above, the number of auxiliary light sources(namely, the final value M_(max) of the image number M) is set to 8,but, it may also be set to another number (4, 16, or the like).

Further, in the defect inspecting apparatus of any one of theembodiments described above, the pattern projection type is adopted as atype of the profile measurement, but, it is also possible to adoptanother type such as, for example, any one of a probe method, alight-section method, and a moire method.

Further, although the defect inspecting apparatus of any one of theembodiments described above sets only one plane of the object 11 as theinspection object, it may also set a plurality of planes of the object11 as the inspection objects.

Further, the defect inspecting apparatus of any one of the embodimentsdescribed above can adopt, when comparing the two-dimensional image withthe non-defective product image, any one of publicly-known methods suchas template matching, image profile comparison, and defect detectionbased on binarization processing.

Further, in the defect inspecting apparatus of any one of theembodiments described above, it is also possible to make the controllingpart 101 execute a part of the operation of the CPU 15. Further, it isalso possible to make the CPU 15 execute a part or all of the operationof the controlling part 101.

The many features and advantages of the embodiments are apparent fromthe detailed specification and, thus, it is intended by the appendedclaims to cover all such features and advantages of the embodiments thatfall within the true spirit and scope thereof. Further, since numerousmodifications and changes will readily occur to those skilled in theart, it is not desired to limit the inventive embodiments to the exactconstruction and operation illustrated and described, and accordinglyall suitable modifications and equivalents may be resorted to, fallingwithin the scope thereof.

1. An inspecting apparatus, comprising: a profile measuring partmeasuring a profile of an object surface; and an image detecting partdetecting a light intensity distribution of the object surface byilluminating the object surface from mutually different plurality ofdirections.
 2. The inspecting apparatus according to claim 1, furthercomprising a controlling part being connected on the profile measuringpart and the image detecting part and conducting non-defective/defectivejudgment of the object surface by controlling the profile measuring partand the image detecting part.
 3. The inspecting apparatus according toclaim 1, wherein the controlling part performs both ofnon-defective/defective judgment of the profile of the object surfaceusing the profile measuring part and non-defective/defective judgment ofthe light intensity distribution of the object surface using the imagedetecting part, and performs comprehensive non-defective/defectivejudgment of the object surface based on results of those two types ofnon-defective/defective judgments.
 4. The inspecting apparatus accordingto claim 3, wherein the controlling part detects a part with apredetermined light intensity distribution on the object surface usingthe image detecting part and excludes the part from a measuring regionof the profile measuring part.
 5. The inspecting apparatus according toclaim 1, wherein: the profile measuring part is a profile measuringapparatus which can measure the object surface by at least projecting apattern; and the image detecting part and the profile measuring partshare at least a part of mutual optical systems.
 6. The inspectingapparatus according to claim 1, wherein a field of view of the imagedetecting part is set larger than a field of view of the profilemeasuring part.
 7. A three-dimensional profile measuring apparatus,comprising: a profile measuring part measuring a profile of an objectsurface; and an image detecting part detecting a light intensitydistribution of the object surface by illuminating the object surfacefrom mutually different plurality of directions.
 8. Thethree-dimensional profile measuring apparatus according to claim 7,wherein the profile measuring part comprises a pattern projecting partprojecting a pattern onto the object surface and a pattern image-formingpart forming an image of the pattern projected onto the object surfaceon an imaging plane.
 9. The three-dimensional profile measuringapparatus according to claim 7, further comprising a controlling partcontrolling the image detecting part to illuminate the object surfacefrom the mutually different plurality of directions at a same time. 10.The three-dimensional profile measuring apparatus according to claim 7,wherein the image detecting part comprises a plurality of light sourcesilluminating the object surface from the mutually different plurality ofdirections.
 11. The three-dimensional profile measuring apparatusaccording to claim 7, wherein the profile measuring part and the imagedetecting part are housed in one chassis.
 12. The three-dimensionalprofile measuring apparatus according to claim 7, further comprising acontrolling part controlling the image detecting part to illuminate theobject surface from the mutually different directions at mutuallydifferent times.
 13. The three-dimensional profile measuring apparatusaccording to claim 7, further comprising a storage part storing atwo-dimensional image formed of the light intensity distribution beingdetected by the image detecting part.
 14. A manufacturing method of astructure, comprising: a designing process producing design informationregarding a profile of a structured object; a forming processmanufacturing the structured object based on the design information; ameasuring process calculating the profile of the structured object beingmanufactured using the three-dimensional profile measuring apparatusaccording to claim 7; and an inspecting process comparing profileinformation obtained in the measuring process and the designinformation.
 15. The manufacturing method of the structure according toclaim 14, further comprising a repair process performing reprocessing ofthe structured object being executed based on a comparison result in theinspecting process.
 16. The manufacturing method of the structureaccording to claim 15, wherein the repair process is a process ofre-executing the forming process.
 17. The manufacturing method of thestructure according to claim 15, wherein the repair process is a processof performing processing on a defective portion of the structured objectbased on the comparison result in the inspecting process.
 18. Aninspecting apparatus, comprising: a profile measuring part measuring aprofile of an object surface; an image detecting part detecting a lightintensity distribution of the object surface by illuminating the objectsurface; and a controlling part setting a measuring object of theprofile measuring part on the object surface based on the lightintensity distribution being detected by the image detecting part. 19.The inspecting apparatus according to claim 18, wherein the imagedetecting part comprises a plurality of light sources illuminating theobject surface from mutually different plurality of directions.
 20. Theinspecting apparatus according to claim 18, wherein: the profilemeasuring part is a pattern projection type profile measuring apparatus;and an illumination intensity distribution of the object surface beingilluminated by the image detecting part is different from an intensitydistribution of pattern projected onto the object surface by the profilemeasuring part.
 21. The inspecting apparatus according to claim 18,wherein the controlling part detects a part with a predetermined lightintensity distribution on the object surface using the image detectingpart and excludes the part from the measuring object of the profilemeasuring part.
 22. The inspecting apparatus according to claim 18,wherein the controlling part conducts non-defective/defective judgmentof the object surface based on a result of which the profile measuringpart measures the object surface.
 23. The inspecting apparatus accordingto claim 18, wherein: the profile measuring part is a pattern projectiontype profile measuring apparatus which can measure the object surface byat least projecting a pattern; and the image detecting part and theprofile measuring part share at least a part of mutual optical systems.24. The inspecting apparatus according to claim 18, wherein a field ofview of the image detecting part is larger than a field of view of theprofile measuring part.
 25. A three-dimensional profile measuringapparatus, comprising: a profile measuring part measuring a profile ofan object surface; an image detecting part detecting a light intensitydistribution of the object surface by illuminating the object surface;and a controlling part setting a measuring part of the profile measuringpart on the object surface based on the light intensity distributionbeing detected by the image detecting part.
 26. The three-dimensionalprofile measuring apparatus according to claim 25, wherein the profilemeasuring part comprises a pattern projecting part projecting a patternonto the object surface and a pattern image-forming part forming animage of the pattern projected onto the object surface on an imagingplane.
 27. The three-dimensional profile measuring apparatus accordingto claim 25, wherein the image detecting part comprises a plurality oflight sources illuminating the object surface from mutually differentplurality of directions.
 28. The three-dimensional profile measuringapparatus according to claim 25, wherein: the profile measuring partcomprises a pattern projecting part projecting a pattern onto the objectsurface and a pattern image-forming part forming an image of the patternprojected onto the object surface on an imaging plane; and anillumination intensity distribution of the object surface beingilluminated by the image detecting part is different from an intensitydistribution of the pattern.
 29. The three-dimensional profile measuringapparatus according to claim 25, wherein: the image detecting partcomprises a plurality of light sources illuminating the object surfacefrom mutually different plurality of directions; and the controllingpart controls the plurality of light sources to be switched on at a sametime.
 30. The three-dimensional profile measuring apparatus according toclaims 25, wherein: the image detecting part comprises a plurality oflight sources illuminating the object surface from mutually differentplurality of directions; and the controlling part controls the pluralityof light sources to be switched on at mutually different times.
 31. Thethree-dimensional profile measuring apparatus according to claim 25,wherein the profile measuring part and the image detecting part arehoused in one chassis.
 32. The three-dimensional profile measuringapparatus according to claim 25, further comprising a storage partstoring a two-dimensional image formed of the light intensitydistribution being detected by the image detecting part.
 33. Amanufacturing method of a structure, comprising: a designing processproducing design information regarding a profile of a structured object;a forming process manufacturing the structured object based on thedesign information; a measuring process calculating the profile of thestructured object being manufactured using the three-dimensional profilemeasuring apparatus according to claim 25; and an inspecting processcomparing profile information obtained in the measuring process and thedesign information.
 34. The manufacturing method of the structureaccording to claim 33, further comprising a repair process performingreprocessing of the structured object being executed based on acomparison result in the inspecting process.
 35. The manufacturingmethod of the structure according to claim 34, wherein the repairprocess is a process of re-executing the forming process.
 36. Themanufacturing method of the structure according to claim 34, wherein therepair process is a process of performing processing on a defectiveportion of the structured object based on the comparison result in theinspecting process.